| Image | Marking | Chip information | Chip details |
|---|---|---|---|
|
M430F1232 | Chip type：TI(德州仪器)Package type: TSSOP-28 | Detail information |
|
S6319 | Chip type：场效应管(MOSFET)Package type: SOP-8 | Detail information |
|
NY7WF | Chip type：DC-DC电源芯片Package type: TSOT-23-6 | Detail information |
|
VP231 | Chip type：CAN芯片Package type: SOIC-8_150mil | Detail information |
|
LM | Chip type：线性稳压器(LDO)Package type: TO-92_Forming1 | Detail information |
|
CKS32F | Chip type：其他处理器及微控制器(MCU)Package type: LQFP48 | Detail information |
|
FE | Chip type：转换器/电平移位器Package type: VSSOP-8 | Detail information |
|
WG7XA | Chip type：LED驱动Package type: TSOT-23-6 | Detail information |
|
BCP | Chip type：三极管(BJT)Package type: SOT-223 | Detail information |
|
e9 | Chip type：模数转换芯片ADCPackage type: LFCSP-20 | Detail information |
|
S61088A | Chip type：DC-DC电源芯片Package type: VQFN-20 | Detail information |
|
LDQQ | Chip type：线性稳压器(LDO)Package type: DFN-6 | Detail information |
|
-10WR | Chip type：电源模块Package type: DIP | Detail information |
|
CA-IS3731HW | Chip type：数字隔离器Package type: WB SOIC-16 | Detail information |
|
A6176m | Chip type：DC-DC电源芯片Package type: SOT-23-6 | Detail information |
|
AZC | Chip type：功率电子开关Package type: TDFN-10-EP(3x3) | Detail information |
|
RCA | Chip type：电压基准芯片Package type: SOT-23(SOT-23-3) | Detail information |
|
VC | Chip type：电源模块Package type: 插件 | Detail information |
|
JWKCJ | Chip type：DC-DC电源芯片Package type: SOT-23-6 | Detail information |
|
MPGG | Chip type：DC-DC电源芯片Package type: QFN-20 | Detail information |
|
6034EST | Chip type：运算放大器Package type: TSSOP-14 | Detail information |
|
BB XTR | Chip type：特殊功能放大器Package type: SOIC-8_150mil | Detail information |
|
A6189M | Chip type：DC-DC电源芯片Package type: SOT23-6 | Detail information |
|
LM | Chip type：线性稳压器(LDO)Package type: TO-92(TO-92-3) | Detail information |
|
LDYT | Chip type：线性稳压器(LDO)Package type: DFN-8 | Detail information |
|
CYPD | Chip type：CYPRESS(赛普拉斯)Package type: QFN-24 | Detail information |
|
B1505S-1WX | Chip type：电源模块Package type: SIP | Detail information |
|
HSA | Chip type：场效应管(MOSFET)Package type: SOT-23 | Detail information |
|
ABT00 | Chip type：逻辑门Package type: TSSOP-14 | Detail information |
|
D4184A | Chip type：场效应管(MOSFET)Package type: TO-252-2(DPAK) | Detail information |
|
A6168Q | Chip type：DC-DC电源芯片Package type: SOT-23-6L | Detail information |
|
3H=3A | Chip type：DC-DC电源芯片Package type: WQFN-20L(3x3) | Detail information |
|
740 | Chip type：光耦-逻辑输出Package type: SO-5 | Detail information |
|
7 | Chip type：时钟缓冲器,驱动器Package type: WQFN-24 | Detail information |
|
A6160S | Chip type：DC-DC电源芯片Package type: SOT-23-6 | Detail information |
|
NIKOS | Chip type：场效应管(MOSFET)Package type: TO-252 | Detail information |
|
7533-3 | Chip type：线性稳压器(LDO)Package type: SOT-89(SOT-89-3) | Detail information |
|
28019A | Chip type：AC-DC控制器和稳压器Package type: SOIC-8_150mil | Detail information |
|
PT2258-S | Chip type：音频接口芯片Package type: SOP-20_300mil | Detail information |
|
2A | Chip type：三极管(BJT)Package type: SOT-23(SOT-23-3) | Detail information |
|
RFJ | Chip type：线性稳压器(LDO)Package type: SOT-223 | Detail information |
|
TP6596C | Chip type：USB芯片Package type: SOP-8 | Detail information |
|
78L05 | Chip type：线性稳压器(LDO)Package type: SOT-89(SOT-89-3) | Detail information |
|
C3 | Chip type：电源模块Package type: DIP | Detail information |
|
L | Chip type：AC-DC控制器和稳压器Package type: DIP-8 | Detail information |
|
A6168C | Chip type：DC-DC电源芯片Package type: SOT-23-6 | Detail information |
|
SAVE | Chip type：电压基准芯片Package type: SOT-23(SOT-23-3) | Detail information |
|
A6069H | Chip type：AC-DC控制器和稳压器Package type: DIP-7 | Detail information |
|
TJA1055/3 | Chip type：CAN芯片Package type: SOIC-14 | Detail information |
|
ME2D | Chip type：场效应管(MOSFET)Package type: SOT-23 | Detail information |
|
A2601 | Chip type：光耦-逻辑输出Package type: PDIP-8 | Detail information |
|
0L032EW1S | Chip type：ST(意法半导体)Package type: LQFP-64_10x10x05P | Detail information |
|
78RH | Chip type：线性稳压器(LDO)Package type: SOT-223 | Detail information |
|
7044 | Chip type：时钟发生器/频率合成器/PLLPackage type: LFCSP-LQ-68 | Detail information |
|
HCeS | Chip type：电源模块Package type: DIP | Detail information |
|
14 | Chip type：逻辑门Package type: TSSOP-14 | Detail information |
|
702 | Chip type：场效应管(MOSFET)Package type: SOT-23(SOT-23-3) | Detail information |
|
BDR | Chip type：DC-DC电源芯片Package type: SON-10_3X3X05P | Detail information |
|
WBCKG | Chip type：DC-DC电源芯片Package type: SOT-23-6 | Detail information |
|
SD642A0 | Chip type：模拟开关/多路复用器Package type: WFQFN-42 | Detail information |
|
2808-2 | Chip type：DC-DC控制芯片Package type: SOIC-8 | Detail information |
|
4953 | Chip type：场效应管(MOSFET)Package type: SOP-8_150mil | Detail information |
|
LMX2571 | Chip type：时钟发生器/频率合成器/PLLPackage type: WQFN-36 | Detail information |
|
LDDW | Chip type：线性稳压器(LDO)Package type: DFN-6 | Detail information |
|
LPC11C24F | Chip type：NXP(恩智浦)Package type: LQFP-48_7x7x05P | Detail information |
|
N28 | Chip type：DC-DC控制芯片Package type: SSOP-28_150mil | Detail information |
|
LDYW | Chip type：DC-DC控制芯片Package type: DFN-10(3x3) | Detail information |
|
14 | Chip type：数字晶体管Package type: SOT-323 | Detail information |
|
24232H | Chip type：电池管理Package type: VQFN-16 | Detail information |
|
GL3224 | Chip type：USB芯片Package type: QFN-32 | Detail information |
|
2561A | Chip type：功率电子开关Package type: VSON-10 | Detail information |
|
K783V3-1000 | Chip type：电源模块Package type: 11.50x9.00x17.50mm | Detail information |
|
25600 | Chip type：DC-DC控制芯片Package type: SOIC-8_150mil | Detail information |
|
H37380 | Chip type：AC-DC控制器和稳压器Package type: DIP-8 | Detail information |
|
e3 | Chip type：CAN芯片Package type: SOIC-8_150mil | Detail information |
|
7353005 | Chip type：功率电子开关Package type: SOIC-18_300mil | Detail information |
|
HG83HNE | Chip type：DC-DC电源芯片Package type: TO-263-5 | Detail information |
|
CE913Q | Chip type：时钟发生器/频率合成器/PLLPackage type: TSSOP-14 | Detail information |
|
C0ST00 | Chip type：光电可控硅(固态继电器)Package type: Through Hole | Detail information |
|
VN11 | Chip type：RS-485/RS-422芯片Package type: SOIC-8 | Detail information |
|
A2 | Chip type：场效应管(MOSFET)Package type: SOT-23(SOT-23-3) | Detail information |
|
e | Chip type：电源模块Package type: SIP | Detail information |
|
BAU | Chip type：数模转换芯片DACPackage type: SC-70-6 | Detail information |
|
MV358I | Chip type：运算放大器Package type: SOIC-8 | Detail information |
|
67F8 | Chip type：DC-DC电源芯片Package type: SOIC-8_150mil | Detail information |
|
C | Chip type：电源模块Package type: DIP | Detail information |
|
Y | Chip type：三极管(BJT)Package type: SOT89 | Detail information |
|
LBPD | Chip type：射频低噪声放大器Package type: DFN-8(3x3) | Detail information |
|
AIN | Chip type：音频功率放大器Package type: TQFN-16_EP | Detail information |
|
H860 | Chip type：线性稳压器(LDO)Package type: QFN-16 | Detail information |
|
BDU | Chip type：DC-DC电源芯片Package type: VSON-10 | Detail information |
|
JWHSJ | Chip type：DC-DC电源芯片Package type: TSOT23-6 | Detail information |
|
WP245 | Chip type：收发器Package type: TSSOP-24 | Detail information |
|
78L05 | Chip type：线性稳压器(LDO)Package type: SOT-89 | Detail information |
|
SOUTHCHIB | Chip type：电池管理Package type: ESOP-8L | Detail information |
|
A9 | Chip type：场效应管(MOSFET)Package type: SC-89 | Detail information |
|
Bd1 | Chip type：电池管理Package type: TDFN-10 | Detail information |
|
4K | Chip type：线性稳压器(LDO)Package type: LLP-4 | Detail information |
|
3CTI | Chip type：DC-DC电源芯片Package type: MSOP-10 | Detail information |
|
L6CE | Chip type：DC-DC电源芯片Package type: DFN-14 | Detail information |